PI: Yang-Ki Hong, University of Alabama.

Project Description

In current US spectrum service allocation, mobile service comprises 15%. According to Canalys forecast, 1.9 billion 5G smartphones will ship in the next five years, overtaking 4G shipments in 2023 and increasing the current mobile service allocation. However, such market growth for 5G mobile application yields harmful electromagnetic interference (EMI), resulting in increasing error due to crosstalk between chips and electronic components. Conventionally, either metal gaskets or sputtered metals have been used to address EMI issues, but they suffer from large space, heavy weight, high cost, and inflexibility. We propose a new design of small form factor, lightweight, low cost and flexible EMI absorber.