PI: Hongbin Yu, Arizona State University.

Project Description:

With increasing demand for electronics System on Chip (SoC) and System in Package (SiP) design in many applications, including consumer electronics and automotive electronics, integrated inductor which is an essential passive component has been widely used in numerous integrated circuits (ICs) such as voltage regulators and RF circuits. In this work, soft ferromagnetic core material, for e.g. amorphous Co‐Zr‐Ta‐B, will be incorporated into on‐chip and in‐ package inductors in order to scale down inductors and improve inductors performance in both inductance density and quality factor.